Objectives
To achieve advanced high precision and high quality 3D micro systems, the EU industry is facing the following MIDs bottlenecks:
- to be able to manufacture high precision 3D microparts integrating plastics and electronics, including 3D plastic system carrier, 3D-conductive tracks and 3D electronics component assembly,
- to be able to significantly reduce the manufacturing cost in order for EU industry to be competitive with low-wage countries,
- to provide the industry with reliable, robust and inline controlled manufacturing processes for plastics and electronics converging technologies.
The 3D HiPMAS project will offer the industry a pilot factory able to provide customised solutions in terms of technical and economical performances.
LPKF Laser Direct Structuring (LDS) technology :
Future 3D-HiPMAS pilot line schema :
3D-HiPMAS pilot line to be set up :
